Applied Materials AMAT Centura AP iSprint

Wafer size: 300mm

Asset HDD not included

Mainframe Type: Centura AP

Process Applications: W

Chamber Qty 4

Process: WCVD

Number of Load Ports: 3  

Carrier ID Reader (E99):Yes  

WIP Delivery Type: OHT  

Dual FI Robots: No

Atmospheric Robot Type: YASKAWA 

Light Curtain: Yes  

In-Situ Metrology Unit: Yes  

Turbo Throttle Valve (TTV) Drive: Direct

Dual Independent Helium Control: 10/10 TORR (std)

Plasma Detect: Yes  

Clean Method: Astron RPS 

Chamber Roughing Pumps

Manufacturer: Kashiyama

Model: SDE1203 BL

Mainframe and Load Lock Pump

Manufacturer: ALCATEL V3.6 A100L IPUP

Model: V3.6 A100L IPUP

Heat Exchanger

Manufacturer: SMC

Model: INR-012D

Qty: 2

Gas Delivery

Gas Line Input: Bottom Feed

Gas Box Configuration

Chamber Argon MFC: 10000 sccm

Chamber Argon MFC: 10000 sccm

Chamber Argon MFC: 6000 sccm

Chamber Argon MFC: 3000 sccm

Chamber NF3 MFC: 2000 sccm

Chamber WF6 MFC: 500 sccm

Chamber WF6 MFC: 100 sccm

Chamber SiH4 MFC: 200 sccm

Chamber H2 MFC: 8000 sccm

Chamber H2 MFC: 3000 sccm

Dry pumps and customer provided items not included on sales