Lintec RAD-2500m/8 Semi-Automatic Wafer Mounter

This system is designed to mount wafers onto pre-cut dicing tape and ring frames, preparing them for downstream dicing, singulation, die separation, and semiconductor packaging processes.

Key features include:

• Accommodates wafers up to 200 mm, depending on installed tooling
• Tape Tension Control for consistent application and reduced air voids
• Safe, blade-free operation using pre-cut tape
• Suitable for dicing tape and dicing die-bonding tape
• Compact design for production, pilot-line, and R&D environments

Electrical requirements are 200-240 VAC, single-phase, 50/60 Hz. The system requires compressed air at 0.44-0.49 MPa and approximately 150 L/min.