ESEC 8003 Dicing Saw

Specification:

Diameter of substratum disc (wafer): 25,4 - 152,4 mm (1" – 6")

Thickness of substratum disc (wafer): 0,01–5,0 mm

Minimal width of cut: 250 μm pre Si wafer

Minimal size of the chip: 1x1 mm

Axle X (shift): 240 mm

Axle Y (index): 165 mm

Index of the step: 0,02–100 mm

Axle Z (vertical): 10 mm

Angular displacement: 0,01–165 stupňov

Spindle speed: 15,000–50,000 rpm

Air pressure: 4,4 - 5,8 bar (64-85 psi)

Water pressure: do 5,8 bar (85 psi)