AMAT P5000 51

Applied Materials P5000 150 mm CVD / Etch Cluster Tool – 4 Chambers

Manufacturer: Applied Materials (AMAT)

Model: P5000

Equipment Type: CVD / Plasma Etch Cluster Tool

Equipment Code: P5K51

Serial Number: 104

Year: Not specified

Wafer Size: 150 mm

Condition: Used – configuration as listed below

Location: Available on request

Lead Time: Available on request

Incoterms: Available on request

Price: Please contact us for quotation

System Overview

Applied Materials P5000 configured as a four-chamber 150 mm cluster tool for CVD and plasma etch processing.

The platform combines two Universal CVD chambers for TEOS processing with two MKII etch chambers.

Process configuration:

• Chamber A – Universal CVD / TEOS
• Chamber B – Universal CVD / TEOS
• Chamber C – MKII / Etch
• Chamber D – MKII / Etch

The system includes an MKII robot, manual dual-cassette loadlock, 15-slot storage elevator, and VME system controller.

Chamber A – Universal CVD / TEOS

Chamber A is configured for TEOS-based CVD processing.

Configuration includes:

• OEM-12B RF generator
• RF match
• 100 Torr Baratron
• Throttle valve
• Chemraz-bonded slit valve
• Lift pin
• Process kit
• C-Chuck

Gas configuration:

• C2F6 – 5,000 sccm
• O2 – 3,000 sccm
• NF3 – 500 sccm
• He/TEOS – 4,000 sccm
• He/TEPO – 3,000 sccm

Horiba STEC liquid delivery configuration includes:

• IV – TEOS
• IV – TEPO
• LFM – TEOS, 3 g
• LFM – TEPO, 0.1 g

Chamber B – Universal CVD / TEOS

Chamber B provides a second Universal CVD process position.

Configuration includes:

• OEM-12B RF generator
• RF match
• 100 Torr Baratron
• Throttle valve
• Chemraz-bonded slit valve
• Lift pin
• Process kit
• C-Chuck

Gas configuration:

• C2F6 – 5,000 sccm
• O2 – 3,000 sccm
• NF3 – 300 sccm
• He/TEOS – 4,000 sccm
• He/TEPO – 3,000 sccm

Horiba STEC liquid delivery configuration includes:

• IV – TEOS
• IV – TEPO
• LFM – TEOS, 3 g
• LFM – TEPO, 0.1 g

Chamber C – MKII Etch

Chamber C is configured for plasma etch processing.

Configuration includes:

• OEM-12B RF generator
• RF match
• 1 Torr Baratron
• Throttle valve
• Chemraz-bonded slit valve
• Lift pin
• Process kit
• Turbo/controller
• Pedestal

Gas configuration:

• CF4 – 200 sccm
• Ar – 100 sccm
• O2 – 50 sccm
• N2 – 500 sccm

Chamber D – MKII Etch

Chamber D provides a second MKII etch process position.

Configuration includes:

• OEM-12B RF generator
• RF match
• 1 Torr Baratron
• Throttle valve
• Chemraz-bonded slit valve
• Lift pin
• Process kit
• Turbo/controller
• Pedestal

Gas configuration:

• CF4 – 200 sccm
• Ar – 100 sccm
• O2 – 50 sccm
• N2 – 500 sccm

Mainframe and Wafer Handling

The system uses a standard P5000 mainframe configuration.

Installed wafer-handling equipment includes:

• MKII robot
• Manual two-cassette loadlock
• 15-slot storage elevator
• SMC flow switch
• WPS
• Mini controller
• Power rack
• Two system monitors

Gas Delivery

The configuration sheet identifies the following gas-delivery hardware:

• Aera 7800 MFC
• STEC 4400MC
• Unit C8161
• Fujikin 5 Ra Max
• Veriflo 10 Ra Max
• Millipore components
• Mott components

Final installed quantities and component part numbers should be confirmed before purchase.

VME / System Controller

The P5000 includes a VME-based system controller configuration.

Listed hardware includes Mini SBC, SBC, SEI, CPU, video, stepper and digital I/O functionality.

The configuration also identifies TC gauges, Buffer I/O, AI Mux, Opto and chopper-driver hardware.

Electrical Requirements

• Line voltage: 200/208 V
• Line frequency: 50/60 Hz
• Line current: 180 A

Cooling

Cooling configuration references an AMAT HX unit.