2016 TEL Precio Octo Wafer Prober
2016 TEL Precio Octo Wafer Prober
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Description
Crated and kept in a bonded facility
Hot chuck (dual temp)
WAPP
GPIB
Automatic frame prober
Specification of wafer, 6-8"
Thickness: 350-1000 um
Die size: 350-75000 um
Specifications
| Manufacturer | TEL |
| Model | Precio Octo Wafer Prober |
| Year | 2016 |
| Condition | Used |
| Stock Number | BM7431 |