2016 Finetech Sigma Die Bonder

- Sub micron placement accuracy

- Capable of substrates up to 300 mm

- Bonding forces up to 100 N

- FPXvision: High resolution magnification

- Software guided alignment verification

- Touch Screen GUI

- Modular design for flexible configurations

Features:

- Automated processes

- Overlay vision alignment system (VAS) with fixed beam splitter

- Integrated Process Management (IPM)

- Real time process observation camera

- Process transfer from system to system

- Virtually unlimited range of advanced bonding technologies

2016 Vintage