1997 Disco DFG 841 Backgrinder

Wafer Size Capacity: Handles 4-inch to 8-inch (approx. 100 mm to 200 mm) diameter wafer

Spindle Design: Dual-spindle system with high-frequency motors (ranging from 1,000 to 7,000 RPM) using 8-inch diamond grinding wheels

Accuracy & Planarity: Achieves high-precision thickness control with planarity accuracy within 0.0015 mm (1.5 µm) across the wafer surfaceAutomation: Features an integrated robotic handling arm with a vacuum chuck/paddle, automatic cassette loading and unloading with same-cassette return, and contact gauge or laser/CCD detection systems for real-time thickness measurements