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2017 BESI/ESEC 2100 FC Plus
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2) BESI/ESEC 2100 FC Plus - Wafer size: 4-12 inch - Track 125mm * Wafer size: 4-12 inch | * Track width: 125mm
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2014 BESI/ESEC 2100 FC Die Bonder-Flip Chip
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BESI/ESEC 2100 The unit is still installed and operating in production. - Track width: 125mm WAFER SIZE: 8...
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