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2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy
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Includes: FINEPLACER lambda Bonding force module FD3 Chip heating module Optional Dispensing ...
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2012 Finetech Fineplacer Matrix BGA
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BGA repair Die bonder Condition: used
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2012 Finetech Fineplacer Matrix BGA
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Die bonder Condition: used
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