Multi chip bonder (2) Heads Flip-chip tool Luer adapter Microscope Mini ejector kit Head #1 ...

AS IS

AS-IS

AS IS

AS IS

- Model: 1WBS1 - Wafer Substrate Bonder - Single Station Wafer Bonder - Used For temporary Wax...

- Model: ABC200 - MHU - Main Handling Unit w/ Genmark GB8 Robot - Module 1: BA200 – Bond Aligne...

- Model: SB6e - Capable of processing up to 6” wafers - Capable of Anodic Bonding - Temperatur...

- Model: SB6e - Capable of processing up to 6” wafers - Tooling included for 100mm - Capable o...