Process: thickness measurement Wafer size: 12" Condition: as is

Process: microscope Wafer size: multi Condition: as is

Process: CHIP breaking M/C Condition: as is Wafer size: 8"

Process: microscope Condition: as is Wafer size: multi

Process: resistivity measurement Wafer size: 12" Condition: as is

Process: lift off M/C Condition: as is Wafer size: 4"

Process: lifetime measurement Condition: complete

Process: ICP etcher Wafer size: 12" Condition: as is

Wafer size; 8" Process: track Condition: part tool

Condition: as is Wafer size: 8" Process: track

Process: Preclean Etchx1, Oxide CVD x2 Condition: as is Wafer size: 8"

Process: Overlay Measurement Condition: as is Wafer size: 12"