Vintage 2012 CE Marked NCS: Yes BBD: Yes 6 or 8 inch chuck available

Process Laser saw Vintage 2009 Wafer Size 8 inch ( Max Workpiece Size 12 inch) Voltage 200~240...

BACK GRINDER WAFER SIZE 6"

Very good condition Came from a lab in Japan Low hours

AUTOMATIC DICING SAW

- Wafer Size: 300 - Group: Electronic - Category: Semiconductor Assembly & Packaging - Family: Di...

***Multiple Units available- please enquire Condition Good Year of Manufacture 2008 Exterior D...

Wafer Sizes:12"/300mm Used to cut SIC, currently configured as a 300mm system, should be able to...