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DISCO DTG8440 TAIKO wafer grinder VINTAGE 2009 CONDITION excellent

Dicing saws, used for 6" wafer Used

Dicing Tool Used

As Is Vintage : 2012 It's a complete tool.

Automatic Dicing Saw, Tool

Vintage 2012 CE Marked NCS: Yes BBD: Yes 6 or 8 inch chuck available

Process Laser saw Vintage 2009 Wafer Size 8 inch ( Max Workpiece Size 12 inch) Voltage 200~240...

- 1.8KW Spindle - NCS & BBD - High/low resolution microscope - 8” chuck table, has 6” table but e...

It’s still running at a fab. Working Condition. Laser: Hamamatsu Stealth dicing SDE 03 Laser h...

Still running at a fab. Working Condition. Laser: Hamamatsu Stealth dicing SDE 03 Laser hours:...

BACK GRINDER WAFER SIZE 6"

Very good condition Came from a lab in Japan Low hours