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Disco DFD-2S/8 Fully Automatic Dicing Saw
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Status: excellent Application: Dicing/Cutting/Slotting various wafers ◆ X - axis Section Drive...
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Disco DFD-3D/8 Fully Automatic Dicing Saw
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Status: excellent Application: Dicing/Cutting/Slotting various wafers ◆ X - axis Section Drive...
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ITI EXC-1 Dicing Saw
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Status: excellent Application: dicing Physical Description - Height : 61" - Width : 53" + 36"...
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Disco DFD 2D/8 Fully Automatic Dicing Saw
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Status: excellent Application: Dicing/Cutting/Slotting various wafers (see images for specs)
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Disco DFD 640 Fully Automatic Dicing Saw
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Status: excellent Application: Dicing/Cutting/Slotting various wafers
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Okamoto ADM6D
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Status: Excellent Application: Dicing for 6 inch (See images for specs)
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2009 ASM Die bonder AD838L
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Vintage: 2009
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2000 Applied Materials Centura II dps poly
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1999 SAMCO RIE-10NR
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1999 SAMCO RIE-10NR WAFER SIZE: 8"
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Edwards iH80
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Asset HDD not included Qty 1- Not overhaul (pump controller is not included) Technical data : ...
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Edwards iH1800SC
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Asset HDD not included Qty 3- Not overhaul (pump controller is not included) Technical data : ...
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Edwards IH1800
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Asset HDD not included Qty 6- Not overhaul (pump controller is not included) Technical data : ...
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