1996 Canon stepper FPA-2500 i3
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Year : 1996, but converted from 6 to 8” wafers in 2009
Status : Prod tests standard in spec.
Wi...
2026 LAM Sabre Extreme systems, using Damascene Cu plating process.
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Lam Sabre Extreme systems, using Damascene Cu plating process
TI, GF, SMIC, Micron, TSMC, etc.
...
2003 Nikon NSR-SF200
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- Vintage: 2003
- Condition: Initial Condition
-Configuration
. Manufacture: Nikon Precision
...
2022 EVG 850TB
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EVG 850TB:
-8" chuck configuration
-200mm
-320 degree C organic bonding
-4x loadport (attache...
2010 BESI Datacon 2200 evo
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Condition: “As is”
Date of manufacture: 2010
Wafer size 200mm
The Datacon 2200 evo high-accura...
Suss Microtec Labspin 8 resist coater for wafers
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SUSS MicroTec‘s LabSpin platform represents the next generation of manual spin coater and develop...
Solitec 5110C
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Solitec 5110C photoresist coater for maximum 9in diameter substrate
single chuck coater for resi...
2013 BESI Datacon 2200 EVO
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Wafer Sizes:
2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm, 12"/300mm
Vintage:
2013...
Veeco CPII Atomic Force Microscope
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Veeco CPII Atomic Force Microscope
Motorized Z stage, scans up to 100um, Mitutoyo M Plan Apo 20S...
2017 Applied Materials VERICELL HT
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Condition: “As is”
Date of manufacture: 11/2017
Wafer size Solar Wafer Inspection System
AMAT ...