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Tool Status: Deinstalled and crated and in storage. (March 2023) Wafer Size 300 mm Process PE-A...

Process: Die Attach Condition: Working

WAFER AS IS

AS-IS

-6x BH angular Z encoder ASM Extreme -3x Force feedback amp cable -1x Y MOTOR COIL -3x X motor...

Wirebonder 2 available

As is taping and packaging system

like new condition

- Manufacturer: ASM - Type: Die Bonder - Model: AD896-IL08

- Manufacturer: ASM - Type: Die Bonder - Model: AD896M-IL08 - Description: ASM AD896M-IL08 Multi ...

ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch SIPLACE CA4: - High Volume Chip Assembly - ...