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Hamamatsu C7103 Back Side Polishing System
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Description:PC Controlled IC Back-side Lapping and Wafer Grinding System Version:200 mm and pack...
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Ohmiker 80B
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The Ohmiker-80B System is specifically designed for high throughput and long-term reliability pe...
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2017 Hiller DP484/11012/FD HILLER DECAPRESS DP
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- Technic special customized for Infineon? no - Any damages/deficits known? no - Manuals existing...
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2005 ESPEC TSA-201SW
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Condition Fair Year of Manufacture 2005
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STS / SPTS MESC Multiplex AOE ICP
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Wafer Size: 4", 6"
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AMAT 0010-70264
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AMAT 0010-70264 ASSY HP ROBOT DRIVER CENTURA Quantity: 1 Condition:used
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Orthodyne 20 Bonder
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KLA FX200
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bmr BMR TheLEDs Etcher ( HiEtch-LX200)
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Kokusai Kokusai VR300DLF tool
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Rudolph Rudolph AXI-S Macro Defect Inspection tool
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Takatori Takatori TSW-1
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