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1996 Hitachi S-8820
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Still installed in the cleanroom under vacuum. Working Condition but sold As Is. It’s comes wit...
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2009 FEI Nova NanoSEM 435 FEG-SEM
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Currently warehoused. Deinstalled by FEI Complete system. - Dual EDS - Spatial resolution: 3-...
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Teradyne/ Eagle ETS364
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ETS-364 Configuration: 2x DPU-16 1x QTMU 6x SPU-100 4x APU-12 1x QHSU 1x Manipulator.
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1996 Applied Materials AMAT P-5000 Mark II WxZ
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Metal CVD (Chemical Vapor Deposition) Deposition Equipment Currently Configured for: 200mm Sof...
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2011 EVG 301 Cleaning System
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- with camera for bond void inspection - For SOI, MEMS and compound semiconductor bonding - Man...
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Applied Materials AMAT P-5000 Mark II MxP Poly
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Polysilicon Etch Etch/Ash/Clean - Plasma Processing Currently Configured for: 200mm Software: ...
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1993 Applied Materials AMAT P-5000 Mark II DLH PECVD TEOS
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PECVD (Chemical Vapor Deposition) Deposition Equipment Currently Configured for: 200mm Softwar...
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1996 Applied Materials AMAT P-5000 Mark II DLH PECVD TEOS
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PECVD (Chemical Vapor Deposition) Deposition Equipment Currently Configured for: 200mm Softwar...
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1991 Applied Materials AMAT P-5000 Mark II DLH PECVD Silane
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PECVD (Chemical Vapor Deposition) Deposition Equipment Currently Configured for: 200mm Softwar...
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1991 Applied Materials AMAT P-5000 Mark II DLH Delta PECVD Silane
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PECVD (Chemical Vapor Deposition) Deposition Equipment Currently Configured for: 200mm Softwar...
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1994 Applied Materials AMAT P-5000 Mark II WxZ
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Metal CVD (Chemical Vapor Deposition) Deposition Equipment Currently Configured for: 200mm Sof...
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Applied Materials AMAT P-5000 Mark II MxP+ Dielectric
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Dielectric Etch Etch/Ash/Clean - Plasma Processing Currently Configured for: 200mm Software: 4...
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