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Minipack-Torre FM76
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- Other Information Date of Manufacture: March 1995 - Sealing and/or Shrinking Machine - Technica...
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Micro Automation M-1100
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Microautomation M-1100 Wafer Dicing Saw Maximum Substrate Diameter 6.000 in (15.2 cm) Spindle T...
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2024 Micro Point Pro iBond 5000
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Micro Point Pro iBond 5000 Deep Access Wedge Bonder
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Micro Automation 16744
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Description Series 401 Dicing Wheel Condition New-Never Used
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Intertest 1014-CBL Bubble tester
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Sold in working condition Digital Controls Icludes Internal Filtarion System and Pump
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Glow Research GLM200
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Glow Research GLM200 Benchtop Plasma Cleaning Tool
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F&K Delvotec 5430
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F&K Delvotec 5430 Semi-Automatic Wire Bonder - Wedge & Ball Bonding - Heated Workholder
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ESEC Cat 2000
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Die Attacher
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Dynatex DX III
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Description Wafer Scriber/Breaker Other Information For Scribing & Breaking of up to 4” Wafers ...
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Plasmatherm LAPECVD and Versaline System
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LAPECVDs with 2x Loadlockports, 2x Processcambers and DMC/OCR reader The VERSALINE Large-Area...
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Suss MS100 Diamond Scriber
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SUSS MS100 DIAMOND SCRIBER consisting of: - Tool Type: Manual diamond scribing system - Substra...
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Dage MCT 22
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- Description Wire Bond Pull Tester - Other Information - Oblique Illumination - Internal Printer...
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