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Vintage : 2010 Complete Laser Head lasts 18,000 hours Can cut SIC

No BBD There is NCS.

- Wafer Size: 300 - Group: Electronic - Category: Semiconductor Assembly & Packaging - Family: Di...

***Multiple Units available- please enquire Condition Good Year of Manufacture 2008 Exterior D...

SCHLEIFMASCHINE DFG 850 / DISCO 6 Fully automatic grinder Description Grinder Wafer Size Range...

Wafer Sizes:12"/300mm Used to cut SIC, currently configured as a 300mm system, should be able to...

Condition: Tool was fully functional and professionally de-installed by a Disco trained technicia...

Vintage: 07/2018 Max Revolution: 60,000 Voltage: 200-240 VAC 3 Phase 12 Amp

Backgrinder Spec in images