Wafer Transfer Station

Wafer Transfer Station

Temperture Chamber, -20° to 85°C

Automatic Flip Chip Die Attacher, 3ea Available

Still installed in Laboratory

Still installed in Laboratory The Edge Inspection System BevelCam MC 450 is a tool for the automa...

ASM AD898 die bonder, 2 sets ASM AD898 for sale Ex works China , both vintage 2006, Can Trial Run.

DNS SDW-69-AVP Coater

Dage BT2400

ESEC 3006 F/X bonders - in working condition - no warranty

Bond Type Thermosonic Ball & Stitch Bond Force Range 20-200 grams X-Y Positioner Range 12" x 5" A...

wafer size setup : 8inch package : IC package setup Input : stack leadframe output : magazine Dis...