1. General − Currently set for 6" wafers - Capable of 8" wafers − 1 Copper (Cu) Plating Chambe...

Vintage = 2011 Process = RTP TCPP mainframe 200 mm SNNF 2 ea Tantalum oxide RTP process chamb...

- Model: Spectrum S-820 Precision Batch Dispensing System - Vintage: 2007 - DJ 9000 Dispense Head

Single chamber

Dual chamber

Only takes active feeders. Mimot Advantage with 6 placement needles Year of manufacture 12/2007 ...

WIRE BONDER

Wafer Saw Not operational

Disc size: 8"/ 200mm Used, as is