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Kulicke & Soffa Maxum Plus
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Semiconductor Assembly & Packaging Bonding Equipment Ball Wire Bonder
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Kokusai Quixace 2
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Wafer size: 300mm Semiconductor Fabrication Traditional Furnaces / Diffusion Systems Vertical ...
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Kokusai Quixace
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Wafer size: 300mm ULT-SiO2 Process Traditional Furnaces / Diffusion Systems Vertical Furnace
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Kokusai ADVANCED ACE 300
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Wafer size: 300mm Vertical Furnace RTP Equipment Semiconductor Fabrication Rapid Thermal Proce...
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GPD PBFT-856VS
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ESEC 2008HSE+
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Semiconductor assembly & packaging Bonding equipment Epoxy die bonder
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DNS SU-3000
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Wafer size: 300mm Semiconductor fabrication Wafer cleaning equipment Single wafer cleaner
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Applied Materials Vantage Radiance RTN_ISSG
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Wafer size: 300mm 2 Chamber radiance ISSG Semiconductor fabrication Rapid thermal processing e...
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Blue M DCI-336-KY-MP550
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Polar Cits 200
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Controlled impedance test system
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Agilent 85033D Calibration Kit
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3.5mm calibration kit
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Tektronix P6150
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