Thermal Press C50MM with open C frame construction
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SPECIFICATIONS:
- Electrical: (Standard) 220VAC (15A MAX)
*Pneumatic (MAX): 10-100 psi (0.7-7 b...
Thermal Press H50MM with H frame construction
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SPECIFICATIONS:
Electrical: (Standard) 220VAC (15A MAX)
*Pneumatic (MAX): 10-100 psi (0.7-7 bar...
2014 PRIMIX Corp. FILMIX 80 Thin-Film Spin System high-Speed Mixer, Buhler FILMIX 80-50 Control Panel
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The thin-film, spin methodology ensures sharp distribution of nanometer-sized particles that has ...
KLA RS75/TCA
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• 6-8” wafer size (150MM)
* Resistivity mapping system
* With flat finder
* H type loader
* R...
Thermo Neslab ThermoFlex 10000 Chiller- Water Cooled 10KW
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CONDITIONExcellent
DescriptionThermoFlex 10000 Recirculating Chiller
2000-230VAC 60hz 3ph/ 200V...
Teradyne J750
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Automated Test Equipment SOC ATE SOC Test System Wafer size: 300mm
AMAT VeritySEM 4I Plus
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- Wafer Size: 300
- Group: Electronic
- Category: Semiconductor Fabrication
- Family: Metrology E...
Kokusai Tsurugis
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- Wafer Size: 300
- Group: Electronic
- Category: Semiconductor Fabrication
- Family: Rapid Therm...
TEL Tactras Vigus RK4
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- Wafer Size: 300
- Group: Electronic
- Category: Semiconductor Fabrication
- Family: Etch Equipm...
TEL Tactras Vigus RK3
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- Group: Electronic
- Category: Semiconductor Fabrication
- Family: Etch Equipment
- Type: Oxide ...






