- Description Series 401 Dicing Wheel - Other Information - TEMPRESS 12467 Blade is for Silicon -...

Semitec PN 811-00-00-03-01 Description Dicing Wheel Condition New-Never Used

- Other Information Date of Manufacture: March 1995 - Sealing and/or Shrinking Machine - Technica...

Microautomation M-1100 Wafer Dicing Saw Maximum Substrate Diameter 6.000 in (15.2 cm) Spindle T...

Micro Point Pro iBond 5000 Deep Access Wedge Bonder

Description Series 401 Dicing Wheel Condition New-Never Used

Sold in working condition Digital Controls Icludes Internal Filtarion System and Pump

Glow Research GLM200 Benchtop Plasma Cleaning Tool

F&K Delvotec 5430 Semi-Automatic Wire Bonder - Wedge & Ball Bonding - Heated Workholder

Die Attacher

Description Wafer Scriber/Breaker Other Information For Scribing & Breaking of up to 4” Wafers ...

LAPECVDs with 2x Loadlockports, 2x Processcambers and DMC/OCR reader The VERSALINE Large-Area...