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Manufacturer: ESEC Type: Die Bonder Model: 2008 HL Description: ESEC 2008HL Die Bonder

300mm Wafer transfer robots, 2 have end effectors. As is

KP-D20BU Camera, KP-D20BU / CCD Color Compact Camera / DC12V / 220mA / With Navitar 1-6010 Lens C...

Double Cabin Machine type one Controller.

Die sorter As is condition

* Size : 6inch * Vintage : 2011 * GaN application * MO source update * Condition : Special A ...

Working Condition SEM

AS-IS Refurbish Wafer Size: 200mm PROCESS: PHOTO WAFER FLOW DIRECTION RIGHT TO LEFT LOADING C...

This Nikon Shock Absorber is used working surplus. This item was inspected and found to be in gre...

This Nikon Shock Absorber is used working surplus. This item was inspected and found to be in gre...

- Part No: 0010-22569 - Rev. 003 - Manufacturer Refurbished This AMAT Applied Materials 0010-225...