The West Bond 4KE is a semi-automatic wire bonder known for its 3-way convertible design, allowin...

Used South Korean CMT16B double-sided polishing machine. Features five independently controlled m...

The system is complete and fully operational. It is in the process of being deinstalled Wafer Si...

We can offer a Micromanipulator 6200 for wafers up to 6 inches in size. Condition: Inspected, fu...

Tool status: running wafers Wafer size: 200mm Fab section: thin film Asset description: Centur...

Tool Status Running Wafers Wafer Size 200 mm Fab Section Thin Film Vintage 1999 Asset Descrip...

Tool Status Running Wafers Wafer Size 200 mm Fab Section Etch Vintage 2001 Asset Description ...

Silicon non-contact thickness measurement

Wire bond inspection (3VI/3O) Inspection Date of Manufacture: 2021-01-01

Cure Oven Bake/Cure Equipment Currently Configured for: 300mm

RESISTOR,CERAMIC,NEAR-NET-SHAPE 8 AVAILABLE