Smart Card reel to reel molding

Smart Card chip module encapsulation

Smart card gold wire bonder

- The Inline curing oven is specially design to cure die attached epoxy/glue on endless tape. - O...

w/ 2x2 cassette/transfer loader 1ea Cymer NL7600A NanoLith laser system, 400V, 70A 1ea mains po...

Robot controller

Isocratic Solvent Manager s/n: G15QDI439M Column Manager Aux s/n: E11CMX367N Column Manager s/n...

Part No: ADH Adhesion Process Station Removed from a TEL Tokyo Electron Clean Track Lithius Syst...

Wafer Sizes: 6"/150mm Vintage: 2019 Bonding SiC OEM Model Description The fully automated t...

Weight: Grinding area section 5200 LBS = 2’358 kg Handling area section 2300 LBS = 1’043 kg To...

DAGE 4000 PLUS Push/Pull Tester Including one S50Kg module Core Parameters Instrument Type: Ele...