Process: H2 ANNEAL 1- System Layout: Main , Utility 2- System Type: L Type 3- Side Maintenance...

- Inline 3D SPI (2013) - M type (Standard size) - 330(L) x 250(W)mm - Main computer formatted and...

Category: CVD Maker: Jusung Model: Cyclon Plus Wafer Size: 300 Config Brooks Back bone. No P...

Inline 3D SPI - XL type (Extra large machine) - 810(L) x 610(W)mm

- Desktop AOI - Basic refurbishment done - 2012 BF-Sirius will be provided with this machine (1+1)

Tool Status Connected Wafer Size 300 mm Fab Section Clean Asset Description Resist Strip Tool ...

CVD System, 12” <45nm process Vintage 2010 2 Chambers: CVD & ALD Process: NiOx, HfOx Trias clu...

Tool Status Connected Wafer Size 300 mm Fab Section Clean Asset Description Resist Strip Tool ...

Tool Status Disconnected Wafer Size NA Fab Section CMP Asset Description SLURRY METROLOGY SYST...

Tool Status Disconnected Wafer Size NA Fab Section CMP Asset Description SLURRY METROLOGY SYST...

Tool Status Disconnected Wafer Size 300 mm Fab Section Metrology Asset Description Darkfeld Wa...

Chiron XACT830A package-level reliability tester, oven-based reliability test system for packaged...